Hello, I am completely new to lasering.

I have requested information from ULS and Epilogue as I see they are both in high regard here.

I was wondering if somebody can explain - how would you
Perforate, Crease and Cut on a substrate like 18pt board. The cut and perfs are simple enough to understand but how does the laser crease a fold line and is it done as part of the same program as the cutting.

In other words do you hit print and the program does it all including adjusting power or backing off the workpiece, moving faster ??? etc to adjust for less depth of cut?

Thanks for your answer

Jorge